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Skybond® 1028 by Industrial Summit Technology is BTDA/MDA based aromatic polyimide solution. Used in adhesive formulations. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Skybond® 1028 offers very good adhesion and toughness and good modulus/flexural strength. Skybond® 703 by Industrial Summit Technology is a BTDA/MDA based aromatic polyimide solution. Used in structural composites and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Skybond® 703 offers very good adhesion and toughness and good modulus/flexural strength. MDA free, aromatic polyimide solution. Used in structural composite and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion, fair toughness and very good modulus/flexural strength. Tough aromatic polyimide solution. Used in adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion to glass and metal, very good toughness, and good modulus/flexural strength. MDA free, aromatic polyimide solution. Used in structural laminates and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion, fair toughness and very good modulus/flexural strength. BTDA/MDA based aromatic polyimide solution. Used in structural laminates and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion and toughness and good modulus/flexural strength. BTDA/MDA based aromatic polyimide solution. Used in adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion and toughness and good modulus/flexural strength. MDA free, aromatic polyimide solution. Used in molding and structural laminates. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion, fair toughness and very good modulus/flexural strength. MDA free, aromatic polyimide solution. Used in formable powder for rigid PI foam. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion, fair toughness and very good modulus/flexural strength. MDA free, aromatic polyimide solution. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion, fair toughness and very good modulus/flexural strength.
Skybond®
Adhesive ingredients supplied by Industrial Summit Technology
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