Technical datasheet
Skybond® 703
Supplied byIndustrial Summit Technology- Last Updated on Jul 14, 2025
Skybond® 703 by Industrial Summit Technology is a BTDA/MDA based aromatic polyimide solution. Used in structural composites and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Skybond® 703 offers very good adhesion and toughness and good modulus/flexural strength.
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Skybond® 703 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
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| Density, Vapor | 0.0 Visible After Login | Visible After Login | Visible After Login |
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| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |