Pyre-ML® RC-5057 by Industrial Summit Technology is a polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds. Pyre-ML® RC-5057 offers good adhesion, very good toughness and very good modulus/flexural strength.
Skybond® 1028 by Industrial Summit Technology is BTDA/MDA based aromatic polyimide solution. Used in adhesive formulations. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Skybond® 1028 offers very good adhesion and toughness and good modulus/flexural strength.
Skybond® 703 by Industrial Summit Technology is a BTDA/MDA based aromatic polyimide solution. Used in structural composites and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Skybond® 703 offers very good adhesion and toughness and good modulus/flexural strength.
