Technical datasheet
Skybond® 705
Supplied byIndustrial Summit Technology- Last Updated on Oct 28, 2002
Tough aromatic polyimide solution. Used in adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion to glass and metal, very good toughness, and good modulus/flexural strength.
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Compliance
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Skybond® 705 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density, Vapor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| NMP ratio | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Solid Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Xylene ratio | 0.0 Visible After Login | Visible After Login | Visible After Login |