Technical datasheet
Skybond® 2601
Supplied byIndustrial Summit Technology- Last Updated on Oct 28, 2002
MDA free, aromatic polyimide solution. Used in formable powder for rigid PI foam. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion, fair toughness and very good modulus/flexural strength.
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Skybond® 2601 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Ethanol ratio | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Solid Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |