Technical datasheet
Skybond® 1028
Supplied byIndustrial Summit Technology- Last Updated on Jul 14, 2025
Skybond® 1028 by Industrial Summit Technology is BTDA/MDA based aromatic polyimide solution. Used in adhesive formulations. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Skybond® 1028 offers very good adhesion and toughness and good modulus/flexural strength.
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Skybond® 1028 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density, Vapor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Ethanol Ratio | 0.0 Visible After Login | Visible After Login | Visible After Login |
| NMP Ratio | 0.0 Visible After Login | Visible After Login | Visible After Login |
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| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Xylene Ratio | 0.0 Visible After Login | Visible After Login | Visible After Login |