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Pyre-ML® RC-5057 by Industrial Summit Technology is a polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds. Pyre-ML® RC-5057 offers good adhesion, very good toughness and very good modulus/flexural strength. Straight, n-methyl-2-pyrrolidone, polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds. Offers good adhesion, very good toughness and very good modulus/flexural strength. Low viscosity polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds. Offers good adhesion, good toughness and very good modulus/flexural strength.
Pyre-ML®
Adhesive ingredients supplied by Industrial Summit Technology
3 Products match your search
Pyre-ML® RC-5057
by Industrial Summit Technology
Pyre-ML® RC-5019
by Industrial Summit Technology
Pyre-ML® RC-5069
by Industrial Summit Technology
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