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Pyre-ML® (Adhesive ingredients)

Supplied by Industrial Summit Technology

3 Products match your search

Pyre-ML® RC-5057

by Industrial Summit Technology

Pyre-ML® RC-5057 by Industrial Summit Technology is a polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds. Pyre-ML® RC-5057 offers good adhesion, very good toughness and very good modulus/flexural strength.
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Pyre-ML® RC-5019

by Industrial Summit Technology

Straight, n-methyl-2-pyrrolidone, polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds. Offers good adhesion, very good toughness and very good modulus/flexural strength.
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Pyre-ML® RC-5069

by Industrial Summit Technology

Low viscosity polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds. Offers good adhesion, good toughness and very good modulus/flexural strength.
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