Technical datasheet
Skybond® 701
Supplied byIndustrial Summit Technology- Last Updated on Oct 28, 2002
MDA free, aromatic polyimide solution. Used in molding and structural laminates. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion, fair toughness and very good modulus/flexural strength.
| CAS Number | Visible After Login |
| Chemical Composition: | Visible After Login |
| Bio Based content | Visible After Login |
| Appearance | Visible After Login |
Compliance
No data available
Availability
Product Status:Visible After Login
Skybond® 701 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density, Vapor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Ethanol ratio | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Solid Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |