Technical datasheet
Pyre-ML® RC-5057
Supplied byIndustrial Summit Technology- Last Updated on Jun 30, 2025
Pyre-ML® RC-5057 by Industrial Summit Technology is a polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds. Pyre-ML® RC-5057 offers good adhesion, very good toughness and very good modulus/flexural strength.
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Pyre-ML® RC-5057 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| NMP ratio | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Solid Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Elongation | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |