Technical datasheet
Pyre-ML® RC-5069
Supplied byIndustrial Summit Technology- Last Updated on Oct 28, 2002
Low viscosity polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds. Offers good adhesion, good toughness and very good modulus/flexural strength.
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Compliance
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Pyre-ML® RC-5069 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Aromatic hydrocarbon | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation @ 25°C | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of elasticity @ 25°C | 0.0 Visible After Login | Visible After Login | Visible After Login |
| NMP ratio | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Solid Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile strength @ 25°C | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |