Polyimide (PI) Resins for Adhesives and Sealants

Stabaxol® P by LANXESS is an aromatic polycarbodiimide. It is used as an antihydrolysis agent in adhesives. The storage stability of Stabaxol® P is 12 months.

Stabaxol® P 200 by LANXESS is polymeric carbodiimide-based hydrolysis stabilizer. It is suitable for polyester polyurethanes and thermoplastic polyester polyurethanes. It can be processed easily in water-based systems like dispersion adhesives. The storage stability of Stabaxol® P 200 is 24 months.

Lapox® ARBMI-11 by Atul is a pure bismaleimide resin in powder form. Exhibits excellent mechanical properties at ambient & elevated temperature, good humidity resistance, toughness with DABA and outstanding heat performance. It can be used alone or in combination with reactive diluents, such as o,o’-diallyl bishenol-A or can be formulated with various chemicals components which reacts with the double bonds of bismaleimides, allyl groups or phenolic groups. Faster productivity can be achieved if resin is allowed to cure above 220°C. Lapox® ARBMI-11 is recommended for high performance structural adhesives application. It has a shelf life of one year.

Pyre-ML® RC-5057 by Industrial Summit Technology is a polyimide solution. Used in adhesives. Provides high thermal stability, radiation, solvent and cryogenic resistance, electrical properties and very low tendency to give off volatile compounds. Pyre-ML® RC-5057 offers good adhesion, very good toughness and very good modulus/flexural strength.

Matrimid® 9725 by Huntsman is a soluble thermoplastic polyimide resins used in adhesives. It is available in yellow color powder form. It is a micro pulverized version of Matrimid® 5218. Matrimid® 9725 exhibits very high glass transition temperature and excellent high-temperature properties for use in structural composites.

Matrimid® 5218 by Huntsman is a soluble thermoplastic polyimide powder. It possesses very high glass transition temperature. It offers excellent adhesion on various substrates and thermal performance.

• It exhibits excellent high temperature properties for use in structural composites and adhesives.
• It is soluble in a variety of common solvents (i.e. CH2Cl2, CHCl3, THF, DMAC, DMF, NMP).
• Matrimid® 5218 is used in exterior vehicle (OEM), interior vehicle (OEM), vehicle assembly (OEM), battery cover sealing & battery assembly, cable sealing, motor & magnet bonding, potting & encapsulating, assembly, thermally & electrically conductive, household appliance assembly, sporting goods, medical device assembly, aircraft and aerospace, marine, rail, recreational vehicle, truck, sport and leisure.

Skybond® 1028 by Industrial Summit Technology is BTDA/MDA based aromatic polyimide solution. Used in adhesive formulations. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Skybond® 1028 offers very good adhesion and toughness and good modulus/flexural strength.

Skybond® 703 by Industrial Summit Technology is a BTDA/MDA based aromatic polyimide solution. Used in structural composites and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Skybond® 703 offers very good adhesion and toughness and good modulus/flexural strength.

Tough aromatic polyimide solution. Used in adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion to glass and metal, very good toughness, and good modulus/flexural strength.

MDA free, aromatic polyimide solution. Used in structural composite and film adhesives. Provides high thermal stability, radiation and solvent resistance, electrical properties, very good radar transparency and very low tendency to outgas. Offers very good adhesion, fair toughness and very good modulus/flexural strength.