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HI-COOL TCF BNS 120 by Carl Spaeter is a thermally conductive filler. It is randomized agglomerates of boron nitride platelets with spherical shape. It exhibits outstanding workability, high flowability and excellent rheological properties in thermosets and thermoplastics. It offers easy dosing & compounding, high filling ability and less interfacial resistance with the polymer matrix. It provides easy blending with other fillers in the plastic system. HI-COOL TCF BNS 120 is used in silicone thermal interface materials and potting compounds with high filler loads. HI-COOL TCF AR-2 by Carl Spaeter is a calcined and purified alumina-based thermally conductive filler. It has low soda and iron content for perfect electrical insulation and tracking resistance. It is a near-spherical particle with smooth surface which leads to outstanding fluidity and dispersibility as well as high filler loads at low viscosity. It offers very fine particle size and narrow distribution that provides a basis for balancing appropriate mechanical compound properties, an easy integration of the products into thin-wall parts and even films. It is recommended for thermal interface materials such as heat sink sheets, heat dissipation boards, heat dissipation greases and semiconductor sealing resins. HI-COOL TCF AR-2 is used in thermal engineering plastics including LED lamp sockets, covers, heat sinks, cooling elements, housing parts and shells. HI-COOL TCF BNF 30 by Carl Spaeter is a hexagonal boron nitride-based thermally conductive filler. It offers excellent heat dissipation, low thermal expansion coefficient compared to mineral fillers, high volume resistivity and low dielectric constant. It possesses low specific density, allowing lightweight performance plastics and low hardness which avoids wear of machines, tools and molds. It is designed for injection molding and high-shear processing. HI-COOL TCF BNF 30 is suitable for thermal engineering plastics, organo-silicones and epoxy resins application. Used in thermal interface materials, E-mobility, battery cell housings, power electronic cases and parts. HI-COOL TCF-AS WD-10 by Carl Spaeter is a spheroidized alumina-based thermal conductive filler with narrow particle size distribution. It provides lowest viscosities in plastic systems, but also highest packing densities by filling the gaps between spheres. It exhibits excellent rheological properties in plastic compounds. It offers high degree of sphericity which leads to a multidirectional, quasi-isotropic heat transfer. It provides very low abrasion in mixers, compounding equipment and injection molding. It reduces energy consumption in processing. HI-COOL TCF-AS WD-10 is suitable for silicone & epoxy resins, thermal engineering plastics, CCL and MCCL laminates.
HI-COOL
Polymer additives supplied by Carl Spaeter
4 Products match your search
HI-COOL TCF BNS 120
by Carl Spaeter
HI-COOL TCF AR-2
by Carl Spaeter
HI-COOL TCF BNF 30
by Carl Spaeter
HI-COOL TCF-AS WD-10
by Carl Spaeter
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