HI-COOL TCF-AS WD-10 by Carl Spaeter is a spheroidized alumina-based thermal conductive filler with narrow particle size distribution. It provides lowest viscosities in plastic systems, but also highest packing densities by filling the gaps between spheres. It exhibits excellent rheological properties in plastic compounds. It offers high degree of sphericity which leads to a multidirectional, quasi-isotropic heat transfer. It provides very low abrasion in mixers, compounding equipment and injection molding. It reduces energy consumption in processing. HI-COOL TCF-AS WD-10 is suitable for silicone & epoxy resins, thermal engineering plastics, CCL and MCCL laminates.
Product family:
Product Type:
| Chemical Composition: | Visible After Login |
| Bio Based content | Visible After Login |
Compliance
No data available
Applications
Recommended markets
No data available
Conversion mode
For which polymer
Availability
Product Status:Visible After Login
HI-COOL TCF-AS WD-10 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Aluminium Oxide Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Iron Oxide Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Porosity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Silicon Dioxide Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Sodium Oxide Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Heat Capacity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
