HI-COOL TCF BNF 30

HI-COOL TCF BNF 30 by Carl Spaeter is a hexagonal boron nitride-based thermally conductive filler. It offers excellent heat dissipation, low thermal expansion coefficient compared to mineral fillers, high volume resistivity and low dielectric constant. It possesses low specific density, allowing lightweight performance plastics and low hardness which avoids wear of machines, tools and molds. It is designed for injection molding and high-shear processing. HI-COOL TCF BNF 30 is suitable for thermal engineering plastics, organo-silicones and epoxy resins application. Used in thermal interface materials, E-mobility, battery cell housings, power electronic cases and parts.