HI-COOL TCF BNS 120 by Carl Spaeter is a thermally conductive filler. It is randomized agglomerates of boron nitride platelets with spherical shape. It exhibits outstanding workability, high flowability and excellent rheological properties in thermosets and thermoplastics. It offers easy dosing & compounding, high filling ability and less interfacial resistance with the polymer matrix. It provides easy blending with other fillers in the plastic system. HI-COOL TCF BNS 120 is used in silicone thermal interface materials and potting compounds with high filler loads.
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HI-COOL TCF BNS 120 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Boric Anhydride Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Boron Nitride (BN) content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Transverse to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Carbon Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Oxygen Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Heat Capacity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |