WANAMID® L2000 by Wanhua Chemical is a media viscosity polyamide 12 (PA 12) with good barrier properties, extremely low density and water absorption rates. It provides excellent self-lubricating properties, processing performance and dimensional stability
- It offers low friction coefficient, outstanding low-temperature-, wear-, impact-, fatigue- and stress cracking resistance.
- It exhibits excellent chemical-, weather- & hydrolysis resistance.
- It is suitable for processing by injection molding and extrusion.
- It is used for sheathing of steel wire cables, loose tubing of optical fibers and connectors.
- WANAMID® L2000 complies with UL 94 HB flame rating.
Product family:
Chemical family:
Product Type:
| Bio Based content | Visible After Login |
Compliance
No data available
Applications
Recommended markets
Applications
Conversion mode
Availability
Product Status:Visible After Login
WANAMID® L2000 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Comparative Tracking Index (CTI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flame Rating, UL 94 | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Impact Strength, Notched | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Tensile Strength at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melt Volume Flow Rate (MVR) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
WANAMID® L2000 Processing Guidelines
Extrusion/Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Injection Temperature | Visible After Login | Visible After Login | |