Technical datasheet
TORZEN® T2000HSL BK20 PA66 Resin
Supplied byRadiciGroup- Last Updated on Jun 27, 2025
TORZEN® T2000HSL BK20 PA66 Resin by RadiciGroup is resin is a toughened, heat stabilized polyamide 66 (PA66) grade. Exhibits high flowability, high impact strength and stiffness. Provides weld line strength and good surface appearance. Suitable for processing by injection molding. TORZEN® T2000HSL BK20 PA66 Resin is recommended for manufacturing of fasteners, connectors, wiring harnesses, emissions canisters and power tools. Complies with RoHS (European directive 2002/95/EC).
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TORZEN® T2000HSL BK20 PA66 Resin properties
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Auto-ignition Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flash Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Tensile Strength at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Decomposition Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Decomposition Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 0.46 MPa (66 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
TORZEN® T2000HSL BK20 PA66 Resin Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
| Cushion (range) | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Front Temperature | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Middle Temperature | Visible After Login | Visible After Login | |
| Moisture Content (Min) | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Nozzle Temperature | Visible After Login | Visible After Login | |
| Rear Temperature | Visible After Login | Visible After Login | |
| Screw Speed | Visible After Login | Visible After Login | |
| Vent Depth | Visible After Login | Visible After Login | |