Technical datasheet
WELLAMID 6600/506 HWCP
Supplied byCP-Polymer-Technik- Last Updated on Sep 23, 2024
WELLAMID 6600/506 HWCP is an unreinforced heat and heat ageing stabilized PA (polyamide) 66 grade. Exhibits improved impact strength. It can be processed using injection molding. Suitable for E&E (Electrical & Electronics) and automotive industry. Potential applications include mechanical, medical, food, and toys industry. Approved by many German and European car manufacturers. Listed on C-UL, LNE- and VDE certificates.
Product family:
Chemical family:
Product Type:
| Bio Based content | Visible After Login |
Compliance
| Certifications & Compliance | Visible After Login |
Applications
Recommended markets
Conversion mode
Availability
Product Status:Visible After Login
WELLAMID 6600/506 HWCP properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Comparative Tracking Index (CTI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flame Rating, UL 94 | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flame Rating, UL 94 | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Parallel | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Vicat Softening Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
WELLAMID 6600/506 HWCP Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Conditioning Time (40°C and 90% Humidity), 1 mm thickness | Visible After Login | Visible After Login | |
| Conditioning Time (40°C and 90% Humidity), 2 mm thickness | Visible After Login | Visible After Login | |
| Conditioning Time (40°C and 90% Humidity), 4 mm thickness | Visible After Login | Visible After Login | |
| Conditioning Time (40°C and 90% Humidity), 6 mm thickness | Visible After Login | Visible After Login | |
| Conditioning Time (40°C and 90% Humidity), 8 mm thickness | Visible After Login | Visible After Login | |
| Conditioning Time (Water @ 40°C), 23°C and 50% Humidity (1 mm thickness) | Visible After Login | Visible After Login | |
| Conditioning Time (Water @ 40°C), 23°C and 50% Humidity (2 mm thickness) | Visible After Login | Visible After Login | |
| Conditioning Time (Water @ 40°C), 23°C and 50% Humidity (4 mm thickness) | Visible After Login | Visible After Login | |
| Conditioning Time (Water @ 40°C), 23°C and 50% Humidity (6 mm thickness) | Visible After Login | Visible After Login | |
| Conditioning Time (Water @ 40°C), 23°C and 50% Humidity (8 mm thickness) | Visible After Login | Visible After Login | |
| Conditioning Time (Water @ 80°C), 23°C and 50% Humidity (1 mm thickness) | Visible After Login | Visible After Login | |
| Conditioning Time (Water @ 80°C), 23°C and 50% Humidity (2 mm thickness) | Visible After Login | Visible After Login | |
| Conditioning Time (Water @ 80°C), 23°C and 50% Humidity (4 mm thickness) | Visible After Login | Visible After Login | |
| Conditioning Time (Water @ 80°C), 23°C and 50% Humidity (6 mm thickness) | Visible After Login | Visible After Login | |
| Conditioning Time (Water @ 80°C), 23°C and 50% Humidity (8 mm thickness) | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |