Plastics and elastomers for Electronics / Computers

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ULTEM™ resin 1000

by SABIC

SABIC
ULTEM™ resin 1000 by SABIC is amorphous, transparent, flame-retarded polyetherimide (PEI) grade. It is metallizable and transparent to microwave radiation & near IR. Provides high stiffness, strength, hydrolytic stability, low creep sensitivity, shrinkage, good metal adhesion, low smoke and toxicity. Offers radiation resistance (gamma, x-ray), chemical-, UV-C resistance, high electric breakdown strength (BDS) and high heat resistance. Exhibits excellent mechanicals in broad temperature range, good dimensional stability and excellent electrical properties. ULTEM™ resin 1000 is suitable for processing by additive manufacturing, injection compression molding, compression molding, foam-, film- & profile extrusion, injection molding, extrusion blow molding and extrusion compounding. Used in rigid packaging, aircraft interiors, defense, outdoor, lawn & landscape, semiconductors, fossil, electric vehicle, heavy truck, automotive interiors, electrical devices & displays, specialty vehicles, ophthalmics, rail, wind energy, sport/leisure, consumer packaging. It is also recommended for personal accessory, textile, lighting, energy storage, home appliances, servomotor, bus, electronic, electrical components, industrial, automotive under the hood, commercial appliance and recreational vehicle. Complies with RoHS, UL94 V-0, V-2 and 5V ratings and aerospace FAR 25.853. The natural, uncolored, material is halogen-free according to standards IEC 61249-2-21, IPC 4101E and JEDEC JS709B. The base material is transparent amber colored but is also available in custom colors- transparent and opaque.
ISCC+ certified bio-based version also available for this grade.
  • Support available
  • Original documents

EP21TDCSMed

by Master Bond

Masterbond Thermoset Epoxy
EP21TDCSMed by Master Bond is a two component, silver filled, electrically conductive epoxy (EP) for bonding, sealing and coating. It offers convenient handling, high thermal conductivity, the ability to withstand thermal cycling and good strength properties.
  • It is formulated to cure at room temperature or elevated temperatures with the optimum cure being overnight at room temperature followed by 2-3 hours at 150-200°F.
  • It bonds well to a wide variety of substrates including metals, composites, glass, ceramics and many plastics.
  • It has reasonably good strength in both shear and peel modes.
  • It is specially formulated to be more forgiving than most epoxies and is capable of withstanding vigorous thermal cycling.
  • It holds up very well to cleaning solutions and sterilants such as EtO and gamma radiation.
  • It exhibits convenient mixing with a 1:1 weight ratio, contains no volatiles for excellent low outgassing properties, and allows for easy application with contact pressure curing, ensuring smooth and even spreading.
  • It offers high bond strength to similar and dissimilar substrates, superior durability with thermal shock and chemical resistance, and is less rigid compared to conventional silver epoxy.
  • EP21TDCSMed is used in medical electronic applications where superior conductivity and biocompatibility are important requirements.
  • It has a shelf life of 3-6 months.
  • It is RoHS complaint and USP Class VI certified.
  • Sustainable option
  • Support available
  • Original documents
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