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Omicure™ U-24M by Huntsman is a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings. It is a Micronized aromatic substituted urea. It can reduce the time and temperature of curing. Omicure™ U-24M provides great degree of acceleration to epoxy & dicy formulations. Omicure™ DDA 5 by Huntsman acts as a curing agent that provides good dispersion, prevents settling and maximizes reactivity.<br>
<ul style="padding-left: 40px;"><li>It is an ultra-micronized grade of dicyandiamide.</li>
<li>It contains approximately 2-3% silica as an anti-caking aid.</li>
<li>It is compatible with all epoxy resins including Bisphenol A and F epoxies, epoxy novolacs and a wide variety of fillers and pigments.</li>
<li>It is recommended for powder coatings.</li></ul> Omicure™ DDA 10 by Huntsman acts as a curing agent for epoxy resins in powder epoxy coatings.<br>
<ul style="padding-left: 40px;"><li>It is a micronized dicyandiamide.</li>
<li>It can be catalyzed with other latent accelerators.</li>
Omicure™ DDA 10 provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F epoxies and epoxy novolacs), with diluted or undiluted resins and with a wide variety of fillers and pigments.</li></ul> Omicure™ U-52M by Huntsman is a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings. It is a micronized aromatic substituted urea. It reduces time and temperature of curing. Omicure™ U-52M provides good acceleration, long shelf life and maintenance of cured properties to epoxy/dicy formulations. Aliphatic Bis Urea, a Micronized cycloaliphatic substituted urea. Reduces time and temperature of curing. Provides long room temperature shelf life to epoxy/dicy formulations. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings. Phenyl Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Most similar in structure to Monuron and Diuron. Does not contain any chlorine. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings. Toluene Bis Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings. Suggested use levels < 5 phr. Unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Primarily designed for use in solvent-based compositions. Compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and compatible with a wide variety of fillers and pigments. Used as a curing agent for epoxy resins in powder epoxy coatings, electronic potting and encapsulating compounds. Non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. Offers good oxidation aging and improved high temperature performance. Possesses low toxicity/less irritating and low cure temperature. Gives long shelf stability for solvent based coatings and high chemical and heat resistance in baked systems. Used as an accelerator for anhydrides or as the sole hardener for catalytic cures of high temperature epoxy resin for coatings. Provides long pot lifes. Aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties to epoxy/dicy formulations. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings.
Omicure™
Coating ingredients supplied by Huntsman