Omicure® DDA 10 by Huntsman acts as a curing agent for epoxy resins in powder epoxy coatings. It is a micronized dicyandiamide. It can be catalyzed with other latent accelerators.
- It contains approximately 2% silica as an anticaking aid.
- The fine particle size helps aid good dispersion, prevent settling, and promote uniform cure to formulated systems without worry of ‘hot spots.
- Omicure® DDA 10 provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F epoxies and epoxy novolacs), with diluted or undiluted resins and with a wide variety of fillers and pigments.
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Omicure® DDA 10 properties
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| Properties | Value & unit | Test condition | Test method |
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