Phenyl Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Most similar in structure to Monuron and Diuron. Does not contain any chlorine. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings.
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Omicure™ U-405M properties
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| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
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