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EPICLON® HP-4032D by DIC Corporation is a high performance distilled naphthalene-based epoxy resin. It is a distilled substance intended for use in adhesives as a liquid encapsulant. It provides ductility and adaptability in toughness. It combines remarkably strong bonding abilities with remarkably little cure shrinkage. Heat and water are resistant to EPICLON® HP-4032D. EPICLON® 855 by DIC Corporation is Epoxy resin diluted with butyl glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. It is available in Asian countries. Applications of EPICLON® 855 include concrete adhesives. EPICLON® 840 by DIC Corporation is a low viscosity bisphenol A type (BPA) epoxy resin. It is available in Asian countries. Applications of EPICLON® 840 include concrete adhesives. EPICLON® 860 by DIC Corporation is a bisphenol A (BPA) epoxy resin. EPICLON® 860 is used in adhesive applications. EPICLON® 520 by DIC Corporation is a 100% reactive diluent, alkyl phenol mono glycidyl ether. It achieves very lower viscosity when mixed with liquid epoxy resins. EPICLON® 520 is used in concrete adhesives. EPICLON® HP-7200HHH by DIC Corporation is a high performance epoxy resin with dicyclopentadiene. Offers ductility and flexible toughness. It combines exceptionally good bonding properties and extremely small cure shrinkage. It improves hard and brittle properties. Shows resistance to heat and water. EPICLON® HP-7200HHH is designed for use in adhesive and IC encapsulants. EPICLON® HP-7200HH by DIC Corporation is a high performance dicyclopentadiene based epoxy resin. It is designed for use in IC encapsulant and adhesives. It exhibits ductility and flexible toughness. EPICLON® HP-7200HH combines exceptionally good bonding properties and extremely small cure shrinkage. It improves hard and brittle properties. It shows resistance to heat and water. EPICLON® EXA-4850-150 by DIC Corporation is a high performance liquid epoxy resin with flexible toughness and ductility. It improves hard and brittle properties. It combines exceptionally good bonding properties and extremely small cure shrinkage. It shows resistance to heat and water. EPICLON® EXA-4850-150 is used in adhesive applications. EPICLON® EXA-835LV by DIC Corporation is a bisphenol F type epoxy resin. EPICLON® EXA-835LV is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives. EPICLON® 835 by DIC Corporation is a bisphenol F type epoxy resin. EPICLON® 835 has a low tendency for crystallization. It exhibits excellent workability and moldability due to low viscosity. Its applications include concrete adhesives.
EPICLON®
Adhesive ingredients supplied by DIC Corporation