EPICLON® HP-4032D by DIC Corporation is a high performance distilled naphthalene-based epoxy resin. It is a distilled substance intended for use in adhesives as a liquid encapsulant. It provides ductility and adaptability in toughness. It combines remarkably strong bonding abilities with remarkably little cure shrinkage. Heat and water are resistant to EPICLON® HP-4032D.
LUCKAMIDE TD-982 by DIC Corporation is a solvent-free, polyamide amine grade. It acts as a curing agent for room temperature epoxy resin. It is useable over long period of time. LUCKAMIDE TD-982 is used as an impregnating agent for adhesives.
EPICLON® 855 by DIC Corporation is Epoxy resin diluted with butyl glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. It is available in Asian countries. Applications of EPICLON® 855 include concrete adhesives.
