EPICLON® HP-7200HH by DIC Corporation is a high performance dicyclopentadiene based epoxy resin. It is designed for use in IC encapsulant and adhesives. It exhibits ductility and flexible toughness. EPICLON® HP-7200HH combines exceptionally good bonding properties and extremely small cure shrinkage. It improves hard and brittle properties. It shows resistance to heat and water.
| Chemical Composition: | Visible After Login |
| Bio Based content | Visible After Login |
Compliance
No data available
Applications
Recommended markets
Applications
For which system
Adhesives
Availability
Product Status:Visible After Login
EPICLON® HP-7200HH properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Epoxy Equivalent Weight | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Softening Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity, Melt | 0.0 Visible After Login | Visible After Login | Visible After Login |