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DIC Corporation to boost epoxy resin capacity by 59% with ¥3 Bn subsidy
Aug 12 2025
DIC Corporation is working to provide unique solutions in the area it has designated “chemitronics,” focusing on materials for semiconductor packaging and cutting-edge electronics components, demand for which is expected to grow in the future. In line with this goal, the Company announced today that it has resolved to build a new epoxy resins production facility at its Chiba Plant, located in the city of Ichihara, Chiba Prefecture.

