Technical datasheet

HP 100205

Supplied byHitech Industries- Last Updated on Nov 27, 2014

Reactive polyamide. Acts as a cuing agent. Exhibits low viscosity. Used in combination with liquid epoxy for cold curing/ambient temperature. Suitable for concrete adhesives. Recommended loading of liquid epoxy EEW-200 is 58.0-60.0 pph.
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HP 100205 properties

Other properties

PropertiesValue & unitTest conditionTest method
Amine Hydrogen Equivalent Weight (AHEW)0.0 Visible After LoginVisible After LoginVisible After Login
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