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Hitech Industries

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HP 100205

Reactive polyamide. Acts as a cuing agent. Exhibits low viscosity. Used in combination with liquid epoxy for cold curing/ambient temperature. Suitable for concrete adhesives. Recommended loading of liquid epoxy EEW-200 is 58.0-60.0 pph.

H-1010

Homopolymer of polyvinyl acetate emulsion. It exhibits high viscosity and excellent bonding & film flow properties. Used mainly in general purpose wood adhesives.

H-1040

Homopolymer of polyvinyl acetate emulsion. It exhibits good film bonding strength and film properties. Used in wood adhesives.

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