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ADMAFINE® SO-C1 distributed by Toyotsu Chemiplas and manufactured by Admatechs is silica filler. It is manufactured by vaporized metal combustion (VMC) method. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. Used in precise plastic molding applications including camera modules, connectors and 3D printers. Improves flatness, abrasion & impact resistance, anisotropy and modulus. It has high purity, fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. Exhibits good rigidity, slidability, thixotropy and dilatancy. Offers low heat expansion, high heat conductivity and heat resistance. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. ADMAFINE® SO-C1 is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. ADMAFINE® AO-502 distributed by Toyotsu Chemiplas and manufactured by Admatechs is alumina filler for heat-dissipating components. It is manufactured by vaporized metal combustion (VMC) method. Suitable for light scattering agent, thermal conductive compounds and ceramic molding products. It features excellent dispersibility and easy blend control. It has high purity, high sphericity, non-porous surface, low surface area ratio and narrow particle size distribution. Exhibits good rigidity, slidability, thixotropy and dilatancy. It is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. ADMAFINE® AO-502 offers low heat expansion, high heat conductivity and heat resistance. ADMAFINE® SO-C6 distributed by Toyotsu Chemiplas and manufactured by Admatechs is a silica-based filler. It is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. It is manufactured by vaporized metal combustion (VMC) method. Exhibits good rigidity, slidability, thixotropy and dilatancy. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. Used in precise plastic molding applications including camera module, connectors and 3D printer. It has high purity, fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. Offers low heat expansion, high heat conductivity and heat resistance. ADMAFINE® SO-C6 improves flatness, abrasion & impact resistance, anisotropy and modulus. ADMAFINE® SO-C5 distributed by Toyotsu Chemiplas and manufactured by Admatechs is silica filler. It is manufactured by vaporized metal combustion (VMC) method. It is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. Exhibits good rigidity, slidability, thixotropy and dilatancy. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. Improves flatness, abrasion & impact resistance, anisotropy and modulus. Used in precise plastic molding applications including camera module, connectors and 3D printers. It has high purity, fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. ADMAFINE® SO-C5 offers low heat expansion, high heat conductivity, and heat resistance. ADMAFINE® SO-E2 distributed by Toyotsu Chemiplas and manufactured by Admatechs acts as a filler based on a low alpha-beam silica. Improves flatness, abrasion & impact resistance, anisotropy and modulus. Used in precise plastic molding applications including camera module, connectors and 3D printer. It has high purity, fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. It is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. It is manufactured by vaporized metal combustion (VMC) method. Exhibits good rigidity, slidability, thixotropy and dilatancy. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. ADMAFINE® SO-E2 offers low heat expansion, high heat conductivity and heat resistance. ADMAFINE® SO-E5 distributed by Toyotsu Chemiplas and manufactured by Admatechs is a low alpha-beam filler. It is a high-purity silica grade with fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. It is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. Offers low heat expansion, high heat conductivity and heat resistance. It is manufactured by vaporized metal combustion (VMC) method. Used in precise plastic molding applications including camera module, connectors and 3D printer. Exhibits good rigidity, slidability, thixotropy and dilatancy. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. ADMAFINE® SO-E5 improves flatness, abrasion & impact resistance, anisotropy and modulus. ADMAFINE® SO-C2 distributed by Toyotsu Chemiplas and manufactured by Admatechs is a silica filler. Improves flatness, abrasion & impact resistance, anisotropy and modulus. It is manufactured by vaporized metal combustion (VMC) method. Used in precise plastic molding applications including camera modules, connectors and 3D printers. It has high purity, fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. Exhibits good rigidity, slidability, thixotropy and dilatancy. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. It is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. ADMAFINE® SO-C2 offers low heat expansion, high heat conductivity and heat resistance. ADMAFINE® AO-509 distributed by Toyotsu Chemiplas and manufactured by Admatechs acts as a filler for heat-dissipating components. It is based on uniformly surface-treated, spherical alumina and is manufactured by vaporized metal combustion (VMC) method. Suitable for light scattering agent, thermal conductive compounds and ceramic molding products. It features excellent dispersibility and easy blend control. It has high purity, high sphericity, non-porous surface, low surface area ratio and narrow particle size distribution. Exhibits good rigidity, slidability, thixotropy and dilatancy. Offers low heat expansion, high heat conductivity and heat resistance. ADMAFINE® AO-509 is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. ADMAFINE® SO-E6 distributed by Toyotsu Chemiplas and manufactured by Admatechs is a low alpha-beam silica filler. It is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. It is a high-purity grade with fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. Offers low heat expansion, high heat conductivity and heat resistance. It is manufactured by vaporized metal combustion (VMC) method. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. Used in precise plastic molding applications including camera module, connectors and 3D printers. Exhibits good rigidity, slidability, thixotropy and dilatancy. ADMAFINE® SO-E6 improves flatness, abrasion & impact resistance, anisotropy and modulus. ADMAFINE® SO-E1 distributed by Toyotsu Chemiplas and manufactured by Admatechs is a filler. It is a low-viscosity, low-alpha-beam silica. It is characterized by processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. It is manufactured by vaporized metal combustion (VMC) method. Exhibits good rigidity, slidability, thixotropy and dilatancy. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. Offers good settling resistance, low heat expansion, high heat conductivity and heat resistance. Used in precise plastic molding applications including camera modules, connectors and 3D printer. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. It has high purity, fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. ADMAFINE® SO-E1 improves flatness, abrasion & impact resistance, anisotropy and modulus.
ADMAFINE®
Polymer additives supplied by Toyotsu Chemiplas
ADMAFINE® by Toyotsu Chemiplas consists of microscopic spherical oxide fillers produced using the proprietary VMC oxidation technology. Available in silica and alumina grades, these fillers are used in polymers for electronics, automotive components, electrical equipment, food-contact applications, and medical devices.
Key benefits of ADMAFINE® brand include:
- Spherical particle morphology for improved flow and packing
- Enhanced mechanical and surface properties
- Consistent particle size distribution