ADMAFINE® SO-C1 distributed by Toyotsu Chemiplas and manufactured by Admatechs is silica filler. It is manufactured by vaporized metal combustion (VMC) method. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. Used in precise plastic molding applications including camera modules, connectors and 3D printers. Improves flatness, abrasion & impact resistance, anisotropy and modulus. It has high purity, fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. Exhibits good rigidity, slidability, thixotropy and dilatancy. Offers low heat expansion, high heat conductivity and heat resistance. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. ADMAFINE® SO-C1 is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness.
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ADMAFINE® SO-C1 properties
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| Properties | Value & unit | Test condition | Test method |
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| Aluminum Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Electrical Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Iron Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Particle Size | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Silica Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Area | 0.0 Visible After Login | Visible After Login | Visible After Login |
| pH | 0.0 Visible After Login | Visible After Login | Visible After Login |


