About Toyotsu Chemiplas

Toyotsu Chemiplas Corporation was established in 2009 by the merger of 3 trading companies specializing in chemicals with their own areas of specialization and headquartered in Minato, Tokyo. Their additives improve flatness, abrasion resistance, impact resistance, anisotropy, modulus, and the processing properties. Tyotsu Chemiplas based on its stance on Sustainability, aims to become a company that contributes to the sustainable growth of society through its business activities. The portfolio of additives supplied by Toyotsu Chemiplas includes fillers, anti-static agents, polymeric dispersants, compatibilizers, additives for thermoplastics, and certain types of surface modifiers.

ADMAFINE® SO-C1

ADMAFINE® SO-C1 distributed by Toyotsu Chemiplas and manufactured by Admatechs is silica filler. It is manufactured by vaporized metal combustion (VMC) method. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. Used in precise plastic molding applications including camera modules, connectors and 3D printers. Improves flatness, abrasion & impact resistance, anisotropy and modulus. It has high purity, fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. Exhibits good rigidity, slidability, thixotropy and dilatancy. Offers low heat expansion, high heat conductivity and heat resistance. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. ADMAFINE® SO-C1 is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness.

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ADMAFINE® AO-502

ADMAFINE® AO-502 distributed by Toyotsu Chemiplas and manufactured by Admatechs is alumina filler for heat-dissipating components. It is manufactured by vaporized metal combustion (VMC) method. Suitable for light scattering agent, thermal conductive compounds and ceramic molding products. It features excellent dispersibility and easy blend control. It has high purity, high sphericity, non-porous surface, low surface area ratio and narrow particle size distribution. Exhibits good rigidity, slidability, thixotropy and dilatancy. It is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. ADMAFINE® AO-502 offers low heat expansion, high heat conductivity and heat resistance.

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ADMAFINE® SO-C6

ADMAFINE® SO-C6 distributed by Toyotsu Chemiplas and manufactured by Admatechs is a silica-based filler. It is characterized by low viscosity, good settling resistance and processing properties including good fluidity, dimensional stability, wear resistance and excellent surface roughness. Designed for semi-conductor sealing and anti-blocking materials, epoxy molding compound, electronic printed circuit boards and engineering plastics. It is manufactured by vaporized metal combustion (VMC) method. Exhibits good rigidity, slidability, thixotropy and dilatancy. Provides low warpage, low CTE by high silica loading, low melt viscosity and low dusting property. Used in precise plastic molding applications including camera module, connectors and 3D printer. It has high purity, fewer ionic impurities, low surface area ratio, a non-porous surface and excellent dispersibility. Offers low heat expansion, high heat conductivity and heat resistance. ADMAFINE® SO-C6 improves flatness, abrasion & impact resistance, anisotropy and modulus.

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