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SEMICOSIL® 911 A/B by Wacker is a thixotropic, pourable, addition-curing, two-part silicone rubber. It cures to a soft silicone gel. Contains low content of volatiles, uncured polymer and ion. Possesses almost constant properties between -40°C and +180°C. SEMICOSIL® 911 A/B is recommended for local encapsulation of delicate electronic components. SEMICOSIL® 927 F by Wacker is a pourable, thermally curable, addition-curing, one-part fluoro silicone rubber. Possesses low content of ion, volatiles and uncured polymer. It cures to a very soft silicone gel. Offers very low hardness and outstanding resistance to chemicals. SEMICOSIL® 927 F is designed for embedding of electronic components in contact with oils, fuels and solvents. SEMICOSIL® 924 by Wacker is a pourable, ready-to-use, thermally curable, thixotropic flow, addition-curing one-part silicone rubber. Possesses low content of ion, volatiles and uncured polymer. It cures to a very soft silicone gel. It shows almost constant properties between
–50°C and +180°C. SEMICOSIL® 924 is recommended for local encapsulation of delicate electronic components including bonded chips on hybrid components exposed to extreme external influences. SEMICOSIL® 912 by Wacker is a low viscosity, pourable, addition-curing, two-part silicone rubber. It has a modular system allows flexible adjustment of pot life and curing time by selection among different catalysts. It cures to a soft silicone gel. Possesses low hardness and excellent tackiness. Shows fast curing at room temperature with Catalyst PT-F, long pot life at room temperature with Catalyst PT and extremely fast curing with Catalyst UV. SEMICOSIL® 912 is designed for encapsulation of electronic components for the automotive and power electronics industries. It is available as 10:1 mixed ratio by weight or volume. SEMICOSIL® 961TC A/B by Wacker is a shear-thinning, easy dispensing, non-slump, addition-curing, two part silicone rubber. It cures at room temperature to a soft and tacky rubber. Exhibits excellent thermal conductivity, low stress and low abrasion. SEMICOSIL® 961TC A/B is designed for interface material for heat sink applications for the electronics industry. SEMICOSIL® 928 by Wacker is a pourable, thermally curable, addition-curing, one-part fluoro silicone rubber. Offers very low hardness and outstanding resistance to chemicals. It cures to a very soft silicone gel. Possesses low content of ion, volatiles and uncured polymer. SEMICOSIL® 928 is designed for embedding of electronic components in contact with oils, fuels and solvents. SEMICOSIL® 963 TC A/B by Wacker is a non-slump, addition-curing, shear-thinning, easy dispensing, two part silicone rubber. It is a gap filler paste material. Exhibits excellent thermal conductivity, low stress and low abrasion. It cures at room temperature to a soft and tacky rubber. SEMICOSIL® 963 TC A/B is designed for interface material for heat sink electronics applications and heat sink of EH/HEV batteries. MICOSIL® 962 TC A/B by Wacker is a non-slump, addition-curing, shear-thinning, easy dispensing, two part silicone rubber. Exhibits excellent thermal conductivity, low stress and low abrasion. MICOSIL® 962 TC A/B is designed for automotive electronics, interface material for heat sink electronics applications and heat sink of EH/HEV batteries. It cures at room temperature to a soft and tacky rubber.
SEMICOSIL®
Plastics and elastomers supplied by Wacker
8 Products match your search
SEMICOSIL® 911 A/B
by Wacker
SEMICOSIL® 927 F
by Wacker
SEMICOSIL® 924
by Wacker
SEMICOSIL® 912
by Wacker
SEMICOSIL® 961TC A/B
by Wacker
SEMICOSIL® 928 F
by Wacker
SEMICOSIL® 963 TC A/B
by Wacker
SEMICOSIL® 962 TC A/B
by Wacker
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