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Kerimid® 8292 N-75 by Huntsman Advanced Materials is a non-MDA polyimide solution, supplied at 75% non-volatiles in methyl etheyl ketone. Offers chemical- & moisture resistance, toughness and thermal-, mechanical- & dielectric properties. Kerimid® 8292 N-75 is suggested for high temperature composites application such as laminates for printed circuit boards. Kerimid® 701 C by Huntsman is a polyimide, used in conjunction with Kerimid® 701. Offers chemical- & moisture resistance, toughness and thermal-, mechanical- & dielectric properties. Kerimid® 701 C is used in laminating products. Meets UL 94 V-1 flame rating. It has low halogen content. Kerimid® 701-1 B by Huntsman is polyimide grade. Offers chemical- & moisture resistance, toughness and thermal-, mechanical- & dielectric properties. Kerimid® 701-1 B is used in laminating products. This grade is halogenated flame retardant additive for use in conjunction with Kerimid® 701 A to achieve UL 94 V-O flammability performance. Kerimid® 701 D by Huntsman is a non-halogen containing polyimide component for Kerimid® 701 A. Offers chemical- & moisture resistance, toughness and thermal-, mechanical- & dielectric properties. Kerimid® 701 D is recommended for composites, high-temperature electrical laminates and adhesives. Kerimid® 701 A N-70 by Huntsman is a non-MDA polyimide solution, supplied at 70% non-volatiles in methyl etheyl ketone. Offers chemical- & moisture resistance, toughness and thermal-, mechanical- & dielectric properties. Kerimid® 701 A N-70 is used in high-temperature circuit boards. It is suitable for use in the manufacture of high performance composites. Provides glass transition temperatures above 250°C with excellent thermostability and Low coefficient of thermal expansion (CTE). Kerimid® 701 A A-70 by Huntsman is a non-MDA polyimide solution, supplied at 70% non-volatiles in acetone. Requires high service temperature and offers chemical- & moisture resistance, toughness and thermal-, mechanical- & dielectric properties. Kerimid® 701 A A-70 is used in printed circuit board, laminates and high-performance composites. Kerimid® 8292 NPM 60 by Huntsman is a non-MDA polyimide solution. It is supplied at 75% non-volatiles in methyl etheyl ketone and propylene glycol mono-methyl ether. Offers chemical- & moisture resistance, toughness and thermal-, mechanical- & dielectric properties. Kerimid® 8292 NPM 60 is used in high-temperature circuit boards.
Kerimid®
Plastics and elastomers supplied by Huntsman
Kerimid® polyimide resins are designed for use in aerospace structures, high-speed circuit board substrates and high-performance adhesives. These systems provide outstanding heat performance (Tg = 220 – 350°C), excellent mechanical properties at both ambient and elevated temperatures, and a low coefficient of thermal expansion. Market applications of Kerimid® include aerospace, adhesives, electronics and defense.
7 Products match your search
Kerimid® 8292 N-75
by Huntsman
Kerimid® 701 C
by Huntsman
Kerimid® 701-1 B
by Huntsman
Kerimid® 701 D
by Huntsman
Kerimid® 701 A N-70
by Huntsman
Kerimid® 701 A A-70
by Huntsman
Kerimid® 8292 NPM 60
by Huntsman
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