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EPICLON® 153-60T by DIC Corporation is a flame retardant, tetra-bromo bisphenol A based epoxy resin. It contains 60% solid in toluene. EPICLON® 153-60T can be used in semiconductor/electrical laminates in electric and electronic applications. EPICLON® 1051-75M by DIC Corporation is a bisphenol A type epoxy resin. It is diluted with methyl ethyl ketone (MEK) solvent. Exhibits good chemical resistance and good bondability. Offers excellent workability. EPICLON® 1051-75M is recommended for laminates, molding materials and composite material applications. EPICLON® 153-60M by DIC Corporation is a flame retardant, tetra-bromo bisphenol A based epoxy resin. It contains 60% solid in methyl ethyl ketone (MEK). EPICLON® 153-60M by DIC Corporation can be used in semiconductor/electrical laminates in electric and electronic applications. EPICLON® 1050-70X by DIC Corporation is a bisphenol A type epoxy resin. It is diluted with xylene solvent. Exhibits good chemical resistance and good bondability. Offers excellent workability. EPICLON® 1050-70X is recommended for anti-corrosive coatings, ship building & heavy duty anti-corrosive, floorings and road engineering applications. EPICLON® 1050-75X by DIC Corporation is a bisphenol A type epoxy resin. It is diluted with xylene solvent. Exhibits good chemical resistance and good bondability. Offers excellent workability. EPICLON® 1050-75X is recommended for anti-corrosive coatings, ship building & heavy duty anti-corrosive, floorings and road engineering applications. EPICLON® 1055 by DIC Corporation is a bondable, bisphenol A based epoxy resin. Offers good chemical resistance and one stage process. EPICLON® 1055 can be used in broad applications including coatings, civil engineering, adhesives, electrical insulating materials and reactive intermediates. EPICLON® 4050 by DIC Corporation is a bondable, bisphenol A based epoxy resin. Offers good chemical resistance. It can be used in broad applications including civil engineering, adhesives, electrical insulating materials and reactive intermediates. EPICLON® 4050 is recommended for powder coating applications. EPICLON® 1055-75X by DIC Corporation is a bisphenol A type epoxy resin. It is diluted with xylene solvent. Exhibits good chemical resistance and good bondability. Offers excellent workability. EPICLON® 1055-75X is recommended for anti-corrosive coatings, ship building & heavy duty anti-corrosive, floorings and road engineering applications. EPICLON® 520 by DIC Corporation is a low viscosity, epoxy resin. It is diluted with reactive alkyl phenol mono glycidyl ether. It is 100% reactive system. EPICLON® 520 by DIC Corporation is recommended for anti-corrosive coatings, non-solvent, ship building & heavy duty anti-corrosive, floorings, concrete coatings, concrete adhesive, adhesive and road engineering applications. EPICLON® 3050 by DIC Corporation is a bondable, bisphenol A based epoxy resin. Offers good chemical resistance. It can be used in broad applications including civil engineering, adhesives, electrical insulating materials and reactive intermediates. EPICLON® 3050 is recommended for powder coating applications.
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Plastics and elastomers supplied by DIC Corporation