EPICLON® 153-60T by DIC Corporation is a flame retardant, tetra-bromo bisphenol A based epoxy resin. It contains 60% solid in toluene. EPICLON® 153-60T can be used in semiconductor/electrical laminates in electric and electronic applications.
AMORVON® W-30 by DIC Corporation is a black, low warp, low flash, modified polyphenylene sulphide [PPS] grade reinforced with 30% glass fiber. It exhibits excellent chemical resistance, heat resistance, superior elevated temperature resistance and excellent dimensional stability. It is inherently flame retardant, recyclable and shows advanced mechanical properties. It has high melting point, tight tolerance, superior strength and modulus. It shows advanced electrical properties under high heat, high humidity and high frequencies. It is suitable for processing by injection molding and is ideal for precision injection molding of intricate and complex parts. It is suitable for industrial applications such as: - precision instruments (small gear pumps, flowmeters etc.). AMORVON® W-30 complies with UL94V-0.
EPICLON® 1051-75M by DIC Corporation is a bisphenol A type epoxy resin. It is diluted with methyl ethyl ketone (MEK) solvent. Exhibits good chemical resistance and good bondability. Offers excellent workability. EPICLON® 1051-75M is recommended for laminates, molding materials and composite material applications.
