EPICLON® 1055 by DIC Corporation is a bondable, bisphenol A based epoxy resin. Offers good chemical resistance and one stage process. EPICLON® 1055 can be used in broad applications including coatings, civil engineering, adhesives, electrical insulating materials and reactive intermediates.
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EPICLON® 1055 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Epoxy Equivalent Weight | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Epoxy Equivalent Weight | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Epoxy Equivalent Weight | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Softening Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Softening Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Softening Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Viscosity, Gardner | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity, Gardner | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity, Gardner | 0.0 Visible After Login | Visible After Login | Visible After Login |