Technical datasheet
ESCONTEK® SP-PESC-566
Supplied byShakun Polymers (Alphagary)- Last Updated on Jun 10, 2015
ESCONTEK® SP-PESC-566 is a semi-conducting compound having excellent heat deformation resistant characteristics. It has superior thermal stress crack resistance, toughness. It is also easy to process and has low volume resistivity. It has been formulated to be easily extrudable using polyethylene extrusion lines. Recommended for skin coating over PE sheath for XLPE insulated high and extra high voltage power cables. It meets with IEC - 60502 regulation.
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ESCONTEK® SP-PESC-566 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Tensile Elongation | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Variation of Elongation | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Variation of Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Optical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Optical Imaging Technology | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Hardness, Shore | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Environmental Stress Cracking Resistance (ESCR) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melt Mass-Flow Rate (MFR or MFI = Melt Flow Index or MI = Melt Index) | 0.0 Visible After Login | Visible After Login | Visible After Login |
ESCONTEK® SP-PESC-566 Processing Guidelines
Extrusion Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |