Technical datasheet
LNP™ KONDUIT™ Compound OX11314 (Asia)
Supplied bySABIC- Last Updated on Jul 31, 2023
LNP™ KONDUIT™ Compound OX11314 (Asia) by SABIC is a non-brominated, non-chlorinated, flame retardant, PFAS-free linear polyphenylene sulfide (PPS) filled with mineral and glass fiber. It offers thermal conductivity and electrical insulation. It is suitable for processing by injection molding. LNP™ KONDUIT™ Compound OX11314 (Asia) is used in electrical, lighting, home appliances, electronics, building component, consumer and industrial applications. It is recommended for mobile phones, tablets and computers.
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Documents related to LNP™ KONDUIT™ Compound OX11314 (Asia)
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LNP™ KONDUIT™ Compound OX11314 (Asia) properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Comparative Tracking Index (CTI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| High-Ampere Arc Ignition (HAI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| High-Ampere Arc Ignition (HAI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hot Wire Ignition (HWI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flame Rating, UL 94 | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Glow Wire Flammability Index (GWFI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Glow Wire Flammability Index (GWFI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Glow Wire Ignition Temperature (GWIT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Glow Wire Ignition Temperature (GWIT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Transverse | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Transverse to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT), Unannealed | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Heat Capacity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| UL RTI, Electrical | 0.0 Visible After Login | Visible After Login | Visible After Login |
| UL RTI, Mechanical with Impact | 0.0 Visible After Login | Visible After Login | Visible After Login |
| UL RTI, Mechanical without Impact | 0.0 Visible After Login | Visible After Login | Visible After Login |
LNP™ KONDUIT™ Compound OX11314 (Asia) Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Front Zone 3 Temperature | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Middle Zone 2 Temperature | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Rear Zone 1 Temperature | Visible After Login | Visible After Login | |
| Screw Speed | Visible After Login | Visible After Login | |
| Shot to Cylinder Size | Visible After Login | Visible After Login | |