KEPAMID® 2333GFH by KPAC is a thermal-stabilized polyamide 66 (PA 66) grade reinforced with 33% glass fiber. It has high stiffness and long-term heat stability at high temperatures. It is suitable for processing by injection molding. Used in automotive, electrical & electronics and industrial parts. KEPAMID® 2333GFH complies with UL 94 HB flame rating.
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KEPAMID® 2333GFH properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flame Rating, UL 94 | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Rockwell R | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Stress | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Deflection Temperature at 0.46 MPa (66 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
KEPAMID® 2333GFH Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Compression Temperature | Visible After Login | Visible After Login | |
| Feed Temperature | Visible After Login | Visible After Login | |
| Metering Temperature | Visible After Login | Visible After Login | |
| Moisture Content | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Pre-Drying Temperature | Visible After Login | Visible After Login | |
Injection molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Barrel Temperature | Visible After Login | Visible After Login | |
| Hopper Temperature | Visible After Login | Visible After Login | |
| Nozzle Temperature | Visible After Login | Visible After Login | |
| Pre-drying Time | Visible After Login | Visible After Login | |
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