Technical datasheet

KEPAMID® 2300SFU

Supplied byKPAC- Last Updated on Dec 17, 2024

KEPAMID® 2300SFU by KPAC is an impact modified PA 66 grade. It is polymerized hexamethylene diamine and adipic acid and has an amide bond (NHCO) of polyamide. It is suitable for high impact processing.
  • Exhibits good heat resistance, high toughness and UV resistance.
  • Offers impressive chemical and oil resistance and has a relatively high rate of moisture absorption.
  • KEPAMID® 2300SFU is suitable for applications such as automotive, electrical & electronics and industrial parts.
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Benefits

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Compliance

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Availability

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KEPAMID® 2300SFU properties

Electrical properties

PropertiesValue & unitTest conditionTest method
Dielectric Constant0.0 Visible After LoginVisible After LoginVisible After Login
Volume Resistivity0.0 Visible After LoginVisible After LoginVisible After Login

Flammability properties

PropertiesValue & unitTest conditionTest method
Flame Rating, UL 940.0 Visible After LoginVisible After LoginVisible After Login

Mechanical properties

PropertiesValue & unitTest conditionTest method
Elongation at Break0.0 Visible After LoginVisible After LoginVisible After Login
Flexural Modulus0.0 Visible After LoginVisible After LoginVisible After Login
Flexural Strength0.0 Visible After LoginVisible After LoginVisible After Login
Hardness, Rockwell R0.0 Visible After LoginVisible After LoginVisible After Login
Impact Strength, Unnotched Charpy0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Modulus0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Strength0.0 Visible After LoginVisible After LoginVisible After Login

Physical properties

PropertiesValue & unitTest conditionTest method
Specific Gravity0.0 Visible After LoginVisible After LoginVisible After Login
Water Absorption0.0 Visible After LoginVisible After LoginVisible After Login

Thermal properties

PropertiesValue & unitTest conditionTest method
Deflection Temperature at 0.45 MPa0.0 Visible After LoginVisible After LoginVisible After Login
Deflection Temperature at 1.8 MPa0.0 Visible After LoginVisible After LoginVisible After Login
Melting Point0.0 Visible After LoginVisible After LoginVisible After Login

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