FARBOSET® 1190 by Cosmic Plastics is a fast curing, anhydride epoxy grade reinforced with mineral and glass. Exhibits improved strength, and excellent thermal shock- and crack resistance. FARBOSET® 1190 is designed for the encapsulation of coils, transformers, switches, and other electrical & electronic components. Complies with ISO 9001:2008 regulation.
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Compliance
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FARBOSET® 1190 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Arc Resistance | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Loss Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Compressive Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Shore | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Molding Pressure | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density, Bulk | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Cure Time | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Cure Time (Hot plate) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Molded Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Spiral Flow (EMMI 1-66A) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Glass Transition Temperature (Tg) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Operating Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
FARBOSET® 1190 Processing Guidelines
Encapsulation Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Mold Temperature | Visible After Login | Visible After Login | |