Technical datasheet

Hostaform® C 9021 80/5201

Supplied byCelanese- Last Updated on May 1, 2026

Hostaform® C 9021 80/5201 by Celanese is a crystalline polyacetal polyoxymethylene (POM) copolymer. Exhibits good resistance to chemicals (solvents, fuels & strong alkalis), wear, long-term fatigue, creep, hydrolysis, stress cracking, thermal and oxidative degradation. Possesses high rigidity, hardness, toughness, excellent resilience, good heat distortion temperature (to 100°C), thermal stability, good slip properties and low moisture absorption. Is suitable for processing by injection molding and sheet- & film extrusion. Hostaform® C 9021 80/5201 by Celanese used in automotive engineering, precision engineering, electric and electronic industry and domestic appliances. Complies with RoHS and meets the recommendation XXXIII for consumer goods of the BgVV and UL flame ratings.
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Hostaform® C 9021 80/5201 properties

Electrical properties

PropertiesValue & unitTest conditionTest method
Comparative Tracking Index (CTI)0.0 Visible After LoginVisible After LoginVisible After Login
Dielectric Strength0.0 Visible After LoginVisible After LoginVisible After Login
Dissipation Factor0.0 Visible After LoginVisible After LoginVisible After Login
Dissipation Factor0.0 Visible After LoginVisible After LoginVisible After Login
Surface Resistivity0.0 Visible After LoginVisible After LoginVisible After Login
Volume Resistivity0.0 Visible After LoginVisible After LoginVisible After Login

Flammability properties

PropertiesValue & unitTest conditionTest method
Burning behavior (US-FMVSS302)0.0 Visible After LoginVisible After LoginVisible After Login
Flame Rating, UL 940.0 Visible After LoginVisible After LoginVisible After Login
Flame Rating, UL 940.0 Visible After LoginVisible After LoginVisible After Login
UL RTI, Mechanical0.0 Visible After LoginVisible After LoginVisible After Login

Mechanical properties

PropertiesValue & unitTest conditionTest method
Elongation at Break, Nominal0.0 Visible After LoginVisible After LoginVisible After Login
Elongation at Yield0.0 Visible After LoginVisible After LoginVisible After Login
Flexural Modulus0.0 Visible After LoginVisible After LoginVisible After Login
Impact Strength, Charpy0.0 Visible After LoginVisible After LoginVisible After Login
Impact Strength, Charpy0.0 Visible After LoginVisible After LoginVisible After Login
Impact Strength, Notched Charpy0.0 Visible After LoginVisible After LoginVisible After Login
Impact Strength, Notched Charpy0.0 Visible After LoginVisible After LoginVisible After Login
Modulus of Elasticity0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Modulus, Creep0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Modulus, Creep0.0 Visible After LoginVisible After LoginVisible After Login

Other properties

PropertiesValue & unitTest conditionTest method
Dielectric Constant0.0 Visible After LoginVisible After LoginVisible After Login
Dielectric Constant0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Strength at Yield0.0 Visible After LoginVisible After LoginVisible After Login

Physical properties

PropertiesValue & unitTest conditionTest method
Density0.0 Visible After LoginVisible After LoginVisible After Login
Density, Melt0.0 Visible After LoginVisible After LoginVisible After Login
Melt Volume Flow Rate (MVR)0.0 Visible After LoginVisible After LoginVisible After Login
Water Absorption0.0 Visible After LoginVisible After LoginVisible After Login

Thermal properties

PropertiesValue & unitTest conditionTest method
CTE, Linear, Normal to Flow0.0 Visible After LoginVisible After LoginVisible After Login
CTE, Linear, Parallel to Flow0.0 Visible After LoginVisible After LoginVisible After Login
Eff. Thermal Diffusibility0.0 Visible After LoginVisible After LoginVisible After Login
Ejection Temperature0.0 Visible After LoginVisible After LoginVisible After Login
Heat Deflection Temperature (HDT)0.0 Visible After LoginVisible After LoginVisible After Login
Melting Point0.0 Visible After LoginVisible After LoginVisible After Login
Specific Heat Capacity0.0 Visible After LoginVisible After LoginVisible After Login
Thermal Conductivity0.0 Visible After LoginVisible After LoginVisible After Login
UL RTI, Electrical0.0 Visible After LoginVisible After LoginVisible After Login

Hostaform® C 9021 80/5201 Processing Guidelines

Injection Molding Processing Guidelines

PropertiesValue & unitTest conditionTest method
Back PressureVisible After LoginVisible After Login
Drying TemperatureVisible After LoginVisible After Login
Drying TimeVisible After LoginVisible After Login
Feed TemperatureVisible After LoginVisible After Login
Holding PressureVisible After LoginVisible After Login
Hooper TemperatureVisible After LoginVisible After Login
Injection PressureVisible After LoginVisible After Login
Manifold TemperatureVisible After LoginVisible After Login
Melt TemperatureVisible After LoginVisible After Login
Moisture Content (Max)Visible After LoginVisible After Login
Mold TemperatureVisible After LoginVisible After Login
Mold shrinkageVisible After LoginVisible After Login
Mold shrinkageVisible After LoginVisible After Login
Nozzle TemperatureVisible After LoginVisible After Login
Screw SpeedVisible After LoginVisible After Login
Screw diameterVisible After LoginVisible After Login
Zone 1 TemperatureVisible After LoginVisible After Login
Zone 2 TemperatureVisible After LoginVisible After Login
Zone 3 TemperatureVisible After LoginVisible After Login
Zone 4 TemperatureVisible After LoginVisible After Login

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