Ultramid® B3UG4 by BASF is a halogen- and phosphorus-free, flame retardant, 20% glass fiber reinforced Polyamide 6 grade. This injection molding grade has outstanding flowability, good electrical properties, and low smoke density.
- It is resistant to the glow wire test (GWFI) up to 960 °C.
- Due to halide-free stabilization, the impact on corrosion is minimized, and sensitive electronic components are better protected.
- Ultramid® B3UG4 is recommended for electronic and railway applications.
- It meets the EN 45545 railway standard.
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| Bio Based content | Visible After Login |
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Ultramid® B3UG4 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Comparative Tracking Index (CTI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Glow Wire Flammability Index (GWFI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Normal | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melt Volume Flow Rate (MVR) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Absorption at Equilibrium | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption at Saturation | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, normal to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 0.46 MPa (66 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Temperature limit for high temperatures, 20000 h, related to 50% decrease of tensile strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Temperature limit for high temperatures, 5000 h, related to 50% decrease of tensile strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Ultramid® B3UG4 Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Melt Temperature | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
