Adhesive ingredients for Solvent-free (100% Solid) Adhesives

Atrepol P180 by Atcoat is a saturated polyester resin with high flexibility. Atrepol P180 combines with Desmodur to produce highly flexible two-component adhesives for glossy foil lamination. Complies with REACH regulation.

Cardolite® LITE 2100R by Cardolite is a cashew nutshell liquid modified hydrocarbon resin. It is used as a modifier for epoxy and polyurethane. It is a low viscosity, low color, renewable product with high bio-content and can be used to replace aromatic hydrocarbon modifiers that are based solely on petrochemicals. Provides excellent dilution efficiency and less effect on dry time than typical phenol modified hydrocarbon resins. Improves compatibility and flexibility of the epoxy system. Possesses good adhesion even to rusted metal substrates, and excellent water- & moisture resistance. Cardolite® LITE 2100R is suitable for high solids and solvent-free construction adhesives such as grouts, self-levelers and mortars. Recommended use level is 30%. Complies with EU REACH.

Desmodur® VKS 20 by Covestro is a mixture of diphenylmethane-4,4'-diisocyanate(MDI) with isomers and higher functional homologues (PMDI). Used in the formulation of reactive solvent-free, two-component adhesives and moisture-curing one-component adhesives for wood, metal and plastics. Shelf life of Desmodur® VKS 20 is 6 months.

BYK® -088 by BYK is a solution of foam-destroying polymers and polysiloxanes. Acts as a defoamer for all solvent-borne and solvent-free adhesives and sealants, especially aromatic-free systems. BYK® -088 recommended level is 0.1 - 1% based upon total formulation.

Irostic® M 7030 by Huntsman is ester-based TPUs for adhesive film applications. It has a broad range of melting points and fast crystallization rate. Offers good resistance to washing agents, excellent adhesion to different substrates and high elastic recovery combined with a soft touch. It provides a solvent-free, environmentally friendly and permanent thermo-bonding solution that enables new design and performance possibilities. Irostic® M 7030 finds applications in footwear products.

Teckros™ Q85 by Teckrez is a high solids rosin ester dispersion. Acts as a tackifier. Teckros™ Q85 is used in pressure-sensitive, construction and other solvent-free adhesive applications.

Irostic® M 8304-HV by Huntsman is ester-based TPU for adhesive film applications. It has a broad range of melting points and fast crystallization rate. Provides good resistance to washing agents, excellent adhesion to different substrates and high elastic recovery combined with a soft touch. It offers a solvent-free, environmentally friendly and permanent thermo-bonding solution that enables new design and performance possibilities. Irostic® M 8304-HV is suitable for footwear products.

DISPERCOLL® S 3030 by Covestro is an aqueous anionic colloidal solution of amorphous silicone dioxide. It is intended as a component for water-borne polychloroprene adhesives based on DISPERCOLL® dispersions. Shows improved moisture resistance and heat resistance. Also applicable for contact and solvent-free adhesives. Shelf life of DISPERCOLL® S 3030 is 6 months. Recommended storage temperature is 10-25°C. It can be used as a formulating component in waterborne adhesives.

BYK® -A 555 by BYK is a solution of foam-destroying polymers, silicone-free. Acts as an air release agent. It shows a good efficiency in various adhesive applications. It should be stirred into the resin prior to the addition of other formulation components. Used in solvent-borne and solvent-free adhesives. It is suitable for epoxy systems and PUR systems. BYK® -A 555 recommended level is 0.1 - 0.5% based upon total formulation.

BYK® -P 105 by BYK lower molecular weight unsaturated polycarboxylic acid polymer. Acts as wetting and dispersing agents. It leads to a controlled flocculation of pigments and bridges are formed between individual pigment particles causing three-dimensional structures to develop. The controlled flocculation of pigments prevents flooding, floating, settling, and sagging of pigments. Has limited compatibility with mineral spirits and adhesives diluted with mineral spirits. It shows a high efficiency with acrylate adhesives to prevent settling of fillers. BYK® -P 105 is recommended for solvent-free adhesives systems and suitable for solvent-borne, water-reducible adhesive systems. Its recommended levels are 2 - 5% inorganic pigments, 5 - 10% organic pigments, 0.5 - 1.5% titanium dioxide.