BYK® -A 555 by BYK is a solution of foam-destroying polymers, silicone-free. Acts as an air release agent. It shows a good efficiency in various adhesive applications. It should be stirred into the resin prior to the addition of other formulation components. Used in solvent-borne and solvent-free adhesives. It is suitable for epoxy systems and PUR systems. BYK® -A 555 recommended level is 0.1 - 0.5% based upon total formulation.
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Solvent-based Adhesives|
Adhesives|
Solvent-free (100% Solid) Adhesives|
Reactive Systems
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BYK® -A 555 properties
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| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
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| Non-volatile Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Refractive Index | 0.0 Visible After Login | Visible After Login | Visible After Login |