BYK® -088 by BYK is a solution of foam-destroying polymers and polysiloxanes. Acts as a defoamer for all solvent-borne and solvent-free adhesives and sealants, especially aromatic-free systems. BYK® -088 recommended level is 0.1 - 1% based upon total formulation.
Product family:
Chemical family:
Product Type:
| Chemical Composition: | Visible After Login |
| Bio Based content | Visible After Login |
Compliance
No data available
Applications
Recommended markets
No data available
For which system
Solvent-free (100% Solid) Adhesives|
Reactive Systems|
Adhesives|
Sealants|
Solvent-based Adhesives
Availability
Product Status:Visible After Login
BYK® -088 properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flash Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Non-volatile Content | 0.0 Visible After Login | Visible After Login | Visible After Login |