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PHENOLITE TD-2106 by DIC Corporation is a phenolic novolac resin. It offers softening point at 88-95°C and high cross-linking density. It shows high heat-, moisture- and chemical resistance. PHENOLITE TD-2106 shows compatibility with epoxy resin curing agents. It is designed for encapsulant applications. PHENOLITE TD-2131 by DIC Corporation is phenolic novolac resin. Exhibits high cross-linking density as well as high heat-, moisture- and chemical resistance. It is compatible with epoxy resin curing agents. PHENOLITE TD-2131 is designed for encapsulant applications in adhesives. PHENOLITE TD-2090 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Exhibits high cross-linking density. It shows high heat-, moisture- and chemical resistance. PHENOLITE TD-2090 shows compatibility with epoxy resin curing agents. PHENOLITE LA-7054 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Possesses high heat-, moisture- and chemical resistance. Shows compatibility with epoxy resin curing agents. It can be diluted in methyl ethyl ketone. PHENOLITE LA-7054 is used in solvent-based adhesive applications. PHENOLITE VH-4170 by DIC Corporation is a bisphenol A novolac resin. Exhibits softening point at 103-108°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE VH-4170 shows compatibility with epoxy resin curing agents. PHENOLITE LA-7052 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. It can be diluted in methyl ethyl ketone. Offers high heat-, moisture- and chemical resistance. Shows compatibility with epoxy resin curing agents. PHENOLITE LA-7052 is used in solvent-based adhesive applications. PHENOLITE LA-3018-50P by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Offers high heat-, moisture- and chemical resistance. It can be diluted in PGM solution. Shows compatibility with epoxy resin curing agents. PHENOLITE LA-3018-50P is used in solvent-based adhesive applications. PHENOLITE TD-2091 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Offers softening point at 105-115°C and high cross-linking density. Shows high heat-, moisture-, and chemical resistance. PHENOLITE TD-2091 shows compatibility with epoxy resin curing agents. PHENOLITE LA-1356 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Provides high heat-, moisture- and chemical resistance. It can be diluted in methyl ethyl ketone. Shows compatibility with epoxy resin curing agents. PHENOLITE LA-1356 is used in solvent-based adhesive applications. PHENOLITE LA-7751 by DIC Corporation is an ATN-type novolac phenol resin which exhibits high cross-linking density. Offers high heat-, moisture-, and chemical resistance. Shows compatibility with epoxy resin curing agents. It can be diluted in methyl ethyl ketone. PHENOLITE LA-7751 is used in solvent-based adhesive applications.
PHENOLITE
Adhesive ingredients supplied by DIC Corporation