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KUREHA Microsphere

Polymer additives supplied by Kureha

9 Products match your search

KUREHA Microsphere M430

by Kureha

KUREHA Microsphere M430 by Kureha is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. Fully expanded, the microsphere increases 3-5X its original diameter with a 80-120X increase in volume. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Under equal weight, KUREHA Microsphere M430 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties. Market applications of KUREHA Microsphere M430 include automobile components, footwear soles.

KUREHA Microsphere S2640

by Kureha

KUREHA Microsphere S2640 by Kureha is a thermally expandable microcapsule for automobile components, footwear soles applications. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. Fully expanded, the microsphere increases 3-5X its original diameter with an 80-120X increase in volume. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Under equal weight, KUREHA Microsphere S2640 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties.

KUREHA Microsphere H1100

by Kureha

KUREHA Microsphere H1100 by Kureha is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to a target diameter and maintains that diameter after cooling. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Fully expanded, the microsphere increases 3-5X its original diameter with a 80-120X increase in volume. Under equal weight, KUREHA Microsphere H1100 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties. Market applications include automobile components, footwear soles.

KUREHA Microsphere H950

by Kureha

KUREHA Microsphere H950 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Fully expanded, the microsphere increases 3-5X its original diameter with a 80-120X increase in volume. Under equal weight, KUREHA Microsphere H950 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties. Market applications include automobile components, footwear soles.

KUREHA Microsphere H750

by Kureha

KUREHA Microsphere H750 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to a target diameter and maintains that diameter after cooling. Fully expanded, the microsphere increases 3-5X its original diameter with a 80-120X increase in volume. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Under equal weight, KUREHA Microsphere H750 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties. Its market applications include automobile components, footwear soles.

KUREHA Microsphere S2340

by Kureha

KUREHA Microsphere S2340 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. Fully expanded, the microsphere increases 3-5X its original diameter with a 80-120X increase in volume. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Under equal weight, KUREHA Microsphere S2340 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties. Market applications of KUREHA Microsphere S2340 include automobile components, footwear soles.

KUREHA Microsphere H850

by Kureha

KUREHA Microsphere H850 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to a target diameter and maintains that diameter after cooling. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Fully expanded, the microsphere increases 3-5X its original diameter with a 80-120X increase in volume. Under equal weight, KUREHA Microsphere H850 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties. Its market applications include automobile components, footwear soles.

KUREHA Microsphere S1940

by Kureha

KUREHA Microsphere S1940 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to a target diameter and maintains that diameter after cooling. Fully expanded, the microsphere increases 3-5X its original diameter with a 80-120X increase in volume. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Under equal weight, KUREHA Microsphere S1940 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties. Market applications include automobile components, footwear soles.

KUREHA Microsphere M330

by Kureha

KUREHA Microsphere M330 by Kureha is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to a target diameter and maintains that diameter after cooling. Fully expanded, the microsphere increases 3-5X its original diameter with a 80-120X increase in volume. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Under equal weight, KUREHA Microsphere M330 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties. Market applications include automobile components, footwear soles.
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