KUREHA Microsphere H950

KUREHA Microsphere H950 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Fully expanded, the microsphere increases 3-5X its original diameter with a 80-120X increase in volume. Under equal weight, KUREHA Microsphere H950 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties. Market applications include automobile components, footwear soles.