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Imicure® AMI-2T by Evonik is an elevated-temperature curing agent for epoxy systems. It is readily compatible with both liquid and solid epoxy resins. Recommended at low loadings of 1-5 phr. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents. Imicure® AMI-2T is designed for electrical laminates, pre-peg composites and encapsulation. Imicure® EMI-24 by Evonik functions as both a curing agent and a cure accelerator for high-performance epoxy resin systems. Used in printed circuit board laminates, filament winding applications and casting applications. Offers shorter
B-stage cure times. Imicure® EMI-24 provides reduced solvent requirements. Imicure® AMI-1 by Evonik is a liquid, elevated-temperature, catalytic curing agent for epoxy resins. Used in pre-preg composites and encapsulation. Imicure® AMI-1 is used at low loadings of 1-5 phr. Imicure® AMI-2 by Evonik is a catalytic, elevated-temperature curing agent for epoxy resins. It is an excellent dicyandiamide accelerator. Imicure® AMI-2 is used in electrical laminates, pre-preg composites and encapsulation. Imicure® Imidazole by Evonik is an elevated-temperature curing agent for epoxy resins. Used in pre-preg composites and encapsulation. Offers very good acceleration. Imicure® Imidazole provides very rapid development of properties.
Imicure®
Polymer additives supplied by Evonik
5 Products match your search
Imicure® AMI-2T
by Evonik
Imicure® EMI-24
by Evonik
Imicure® AMI-1
by Evonik
Imicure® AMI-2
by Evonik
Imicure® Imidazole
by Evonik
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